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RTX Raytheon Technologies

Electrical Engineer II - Microelectronics Packaging Onsite

Department
Engineering
Job Type / Location
Cedar Rapids, IA
Experience Required
3+ years
Posted On

As an Electrical Engineer II in Microelectronics Packaging, you will be responsible for designing and developing microelectronics packaging solutions that meet the needs of our customers. You will work closely with cross-functional teams to develop and implement new packaging technologies and processes. This role requires a strong understanding of electrical engineering principles and microelectronics packaging design.

Key Responsibilities:

  • Design and develop microelectronics packaging solutions that meet customer requirements and specifications.
  • Collaborate with cross-functional teams to develop and implement new packaging technologies and processes.
  • Conduct electrical and thermal analysis of packaging designs to ensure reliability and performance.
  • Develop and maintain technical documentation and reports to support packaging design and development.
  • Stay up-to-date with industry trends and advancements in microelectronics packaging and electrical engineering.

Requirements:

  • Bachelor's degree in Electrical Engineering or related field.
  • 5+ years of experience in microelectronics packaging design and development.
  • Strong understanding of electrical engineering principles and microelectronics packaging design.
  • Proficiency in Python, C++, Ansys, and SolidWorks.
  • Excellent communication and collaboration skills.

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