As a Principal Mechanical Engineer – Electronics Packaging, you will be responsible for leading the design and development of innovative electronics packaging solutions for our cutting-edge products. You will work closely with cross-functional teams to ensure that our packaging solutions meet the highest standards of quality, reliability, and performance. Key Responsibilities include:
- Develop and implement advanced packaging designs for electronic components and systems
- Conduct finite element analysis (FEA) and computational fluid dynamics (CFD) simulations to optimize packaging performance
- Collaborate with electrical engineers to ensure seamless integration of packaging with electronic systems
- Develop and maintain detailed design documentation and technical reports
- Lead and mentor junior engineers to develop their skills and expertise
Requirements:
- Master's degree in Mechanical Engineering or related field
- 10+ years of experience in mechanical engineering, with a focus on electronics packaging
- Proven track record of leading cross-functional teams and mentoring junior engineers
- Strong knowledge of finite element analysis (FEA) and computational fluid dynamics (CFD) software
- Excellent communication and problem-solving skills